| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent displacement between electronic components in connection by flip chip bonding. <P>SOLUTION: A first electronic component arranged with a plurality of first bumps, and a second electronic component arranged with a plurality of second bumps at positions corresponding to the plurality of first bumps are prepared (step S1). A bump shaping process is performed for the one electronic component out of the first and second electronic components so that each tip of the plurality of first bumps is formed into a shape decentered in a direction from the center of the first electronic component toward the outer periphery thereof (step S3). Thereafter, the first and second electronic components are arranged oppositely to each other (step S4), the first and second bumps of them are melted (step S5), and thereby the first and second electronic components are connected to each other. <P>COPYRIGHT: (C)2011,JPO&INPIT |
