发明名称 FILM SLITTING METHOD AND FILM SLITTING DEVICE
摘要 PROBLEM TO BE SOLVED: To prolong the service period of a cutting blade while preventing a cutting device or a film from being stained with chip produced by cutting. SOLUTION: A film 16 under conveyance is cut in the conveying direction with a slitting device. The slitting device 23 includes a slitter 41 having an outer blade 42 and an inner blade 43, and a liquid feeding unit 48. The liquid feeding unit 48 feeds the liquid 51 to a contact position of the outer blade 42, the inner blade 43 and the film 16. The liquid 51 is guided to a blade part 42b of the outer blade 42 by a pipe 52 of the liquid feeding unit 48, and fed to the contact position via the rotating outer blade 42. The liquid 51 collects machining dust generated by the cutting of the film 16 by the slitter 41, and is deposited on the film 16 or a side end 16a. While the liquid 51 is evaporated, the machining dust is integrated with the film 16 and the side end 16a. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011125932(A) 申请公布日期 2011.06.30
申请号 JP20090283704 申请日期 2009.12.15
申请人 FUJIFILM CORP 发明人 TANIMURA KENTARO
分类号 B26D7/18;B26D1/02;B26D1/24 主分类号 B26D7/18
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