| 摘要 |
PROBLEM TO BE SOLVED: To provide a hot melt adhesive that can be attached and fixed to an adherend at a relatively low temperature, can be bonded to the adherend by heating to 150°C or higher, exhibits high shearing adhesive force and can be made recyclable by re-heating as it is thermoplastic. SOLUTION: The hot melt adhesive comprises (A) a monomeric or oligomeric thermoplastic epoxy resin having a number-average molecular weight of 110-1,200 and (B) a polymeric thermoplastic epoxy resin having a number-average molecular weight of at least 7,000, where the weight ratio of the monomeric or oligomeric thermoplastic epoxy resin to the polymeric thermoplastic epoxy resin is 6:4 to 8:2. Concretely, the monomeric or oligomeric thermoplastic epoxy resin (A) preferably comprises (a) a bifunctional epoxy compound, (b) a bifunctional compound bearing two phenolic hydroxy groups and (c) one or two or more compounds selected from the group consisting of a phosphorous catalyst, a 1,2-alkylenebenzimidazole, and a 2-aryl-4,5-diphenylimidazole while the polymeric thermoplastic epoxy resin (B) is one obtained by polyaddition of (a) a bifunctional epoxy compound and (b) a mixture of bifunctional compounds bearing two functional groups, which may be the same or different, selected from the group consisting of a phenolic hydroxy group, a carboxy group, a mercapto group, an isocyanate group and a cyanate ester group. COPYRIGHT: (C)2011,JPO&INPIT
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