发明名称 ANISOTROPIC CONDUCTIVE ADHESIVE COMPOSITE AND FILM, AND CIRCUIT CONNECTING STRUCTURE INCLUDING THE SAME
摘要 An anisotropic conductive adhesive composite and film includes a binder and conductive particles dispersed in the binder. The conductive particles include a copper core particle and a metal coating layer coated on a surface of the corresponding copper core particle.
申请公布号 US2011155430(A1) 申请公布日期 2011.06.30
申请号 US20100974476 申请日期 2010.12.21
申请人 LEE GYU HO;PARK YOUNG WOO;CHO IL RAE;KIM YOUNG HUN;PARK KYOUNG SOO;PARK JIN SEONG;UH DONG SEON;LEE KYUNG JIN;JUNG KWANG JIN 发明人 LEE GYU HO;PARK YOUNG WOO;CHO IL RAE;KIM YOUNG HUN;PARK KYOUNG SOO;PARK JIN SEONG;UH DONG SEON;LEE KYUNG JIN;JUNG KWANG JIN
分类号 H05K1/09;H01B1/22 主分类号 H05K1/09
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