| 摘要 |
An attach film composition for semiconductor assembly includes a polymer binder, an epoxy resin, a phenolic epoxy curing agent, a curing accelerator, a silane coupling agent, and an inorganic filler. The attach film composition may have an exothermic peak start temperature of about 300° C. or more in curing, and a melt viscosity of about 1.0×105 to about 5.0×106 Poise at 175° C. after curing at 150° C. for 1 hour and a melt viscosity of about 1.0×105 to about 5.0×106 Poise at 175° C. after curing at 175° C. for 2 hours.
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