HEAT SINK FOR ELECTRONIC DEVICE, AND PROCESS FOR PRODUCTION THEREOF

摘要

PROBLEM TO BE SOLVED: To provide a heat sink for an electronic device that has low heat expansion properties, excellent heat conductivity particularly in the direction of thickness, and a reduced entire thickness.

SOLUTION: The heat sink for the electronic device is produced by joining a Cr-Cu alloy sheet comprising a Cu matrix and more than 30 mass% and not more than 80 mass% of Cr to a Cu sheet, and rolling the joined product, thereby producing a laminate having a Cr-Cu alloy layer and a Cu layer.

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