发明名称 |
DIAMOND COVERED CUTTING EDGE |
摘要 |
PROBLEM TO BE SOLVED: To provide a diamond covered cutting edge capable of preventing the deterioration of sliding or cutting quality while sufficiently making the most of the wear resistance of diamond in the cutting edge for cutting or scribing a brittle material such as an optical fiber or glass substrate. SOLUTION: In the diamond covered cutting edge including a base material and a diamond layer covering the surface of the base material, the average thickness of the diamond layer in an edge part of the cutting edge is≥0.5μm and≤8.0μm, the diamond average particle diameter on the surface of the diamond layer is≥0.5μm and≤6.0μm and the surface of the diamond layer is not surface-smoothed after covered. COPYRIGHT: (C)2011,JPO&INPIT |
申请公布号 |
JP2011126754(A) |
申请公布日期 |
2011.06.30 |
申请号 |
JP20090289150 |
申请日期 |
2009.12.21 |
申请人 |
SUMITOMO ELECTRIC HARDMETAL CORP;SUMITOMO ELECTRIC IND LTD;SEI OPTIFRONTIER CO LTD |
发明人 |
MEGURO KIICHI;HONMA TOSHIHIKO;HASEGAWA MASAHIRO |
分类号 |
C03B33/027;B28D1/24;B28D5/00;C03B37/16;H01L21/301 |
主分类号 |
C03B33/027 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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