发明名称 |
HERMETIC MEMS DEVICE AND METHOD FOR FABRICATING HERMETIC MEMS DEVICE AND PACKAGE STRUCTURE OF MEMS DEVICE |
摘要 |
A hermetic microelectromechanical system (MEMS) package includes a CMOS MEMS chip and a second substrate. The CMOS MEMS Chip has a first substrate, a structural dielectric layer, a CMOS circuit and a MEMS structure. The structural dielectric layer is disposed on a first side of the first structural substrate. The structural dielectric layer has an interconnect structure for electrical interconnection and also has a protection structure layer. The first structural substrate has at least a hole. The hole is under the protection structure layer to form at least a chamber. The chamber is exposed to the environment in the second side of the first structural substrate. The chamber also comprises a MEMS structure. The second substrate is adhered to a second side of the first substrate over the chamber to form a hermetic space and the MEMS structure is within the space.
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申请公布号 |
US2011156106(A1) |
申请公布日期 |
2011.06.30 |
申请号 |
US20090647559 |
申请日期 |
2009.12.28 |
申请人 |
SOLID STATE SYSTEM CO., LTD. |
发明人 |
LEE CHIEN-HSING;HSIEH TSUNG-MIN;LIOU JHYY-CHENG |
分类号 |
H01L29/84;H01L23/00;H01L27/092 |
主分类号 |
H01L29/84 |
代理机构 |
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