发明名称 MOLDING MATERIAL, MOLDED ARTICLE AND PROCESS FOR PRODUCTION THEREOF, AND HOUSING FOR ELECTRIC/ELECTRONIC DEVICE
摘要 <p>Disclosed are: a molding material having high stiffness (bending elastic modulus), good bending strength, high heat resistance (a high thermal deformation temperature) and excellent moldability and also having good impact resistance (Charpy impact strength); and a molded article. The molding material comprises: a cellulose derivative which contains at least one group that is produced by substituting a hydrogen atom in a hydroxy group contained in a cellulose by a group (A) and at least one group that is produced by substituting a hydrogen atom in a hydroxy group contained in the cellulose by a group (B); and a acrylonitrile-styrene copolymer which contains a rubbery component as a dispersed phase. (A) A hydrocarbon group: -RA. (B) An acyl group: -CO-RB (wherein RB represents a hydrocarbon group).</p>
申请公布号 WO2011078292(A1) 申请公布日期 2011.06.30
申请号 WO2010JP73247 申请日期 2010.12.22
申请人 FUJIFILM CORPORATION;YOSHITANI TOSHIHIDE;UEHIRA SHIGEKI 发明人 YOSHITANI TOSHIHIDE;UEHIRA SHIGEKI
分类号 C08L1/08;C08L55/02 主分类号 C08L1/08
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