发明名称 DIMPLE PLATE AND METHOD OF MANUFACTURING THE SAME, AND HEAT RADIATION PLATE AND METHOD OF MANUFACTURING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a dimple plate and a method of manufacturing the same, and a heat radiation plate and a method of manufacturing the same, enhancing heat conductivity in a thickness direction of a heat radiation plate, of uniformly maintaining heat radiation characteristics in the thickness direction of the heat radiation plate independent of a part of the heat radiation plate, and achieving a heat radiation plate with a large Invar ratio and a low thermal expansion coefficient in a plate surface direction. SOLUTION: A dimple plate 1 has a plurality of dimples 2 formed on a surface of a flat plate 5 in a longitudinal direction and a width direction of the flat plate 5 in a predetermined pitch. In the dimple plate 1, the pitch in a width direction of the dimple 2 is equal to or less than 0.5 mm, and a ratio of an area of a region in which a hole 3 penetrating the flat plate 5 in the bottom part of the dimple 2 is formed, to the superficial area of the flat plate 5, is equal to or less than 15%. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011129640(A) 申请公布日期 2011.06.30
申请号 JP20090285470 申请日期 2009.12.16
申请人 HITACHI CABLE LTD 发明人 KIYOFUJI MASAHIRO;NAKAGAWA KAZUHIKO;KUROKI KAZUMA
分类号 H01L23/36;B21B1/22;B21D31/00;B21D53/04 主分类号 H01L23/36
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