| 摘要 |
A flip chip semiconductor package is provided. In one embodiment, the flip chip semiconductor package comprises a first substrate having a first surface and a second surface opposite the first surface, a semiconductor chip mounted on the first surface of the first substrate by solder bumps, a thermally-conductive stiffener mounted above the first surface of the first substrate and around the chip to define a cavity region therebetween, one or more molding compound material disposed in the cavity region, and a second substrate mounted to the second surface of the first substrate by solder balls.
|
