发明名称 |
Use of die backside films to modulate EOL coplanarity of thin packages while providing thermal capability and laser markability of packages |
摘要 |
A microelectronic package comprises a die (110) having a front side (111) containing active circuitry (115) and a back side (112) opposite the front side and a film (120) on the back side of the die. The film has a thickness (121) of at least 20 micrometers, a Young's modulus of at least 10 GPa, and a post-cure glass transition temperature of at least 100° Celsius. |
申请公布号 |
US2011156283(A1) |
申请公布日期 |
2011.06.30 |
申请号 |
US20090655283 |
申请日期 |
2009.12.28 |
申请人 |
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发明人 |
GANAPATHYSUBRAMANIAN SHANKAR;ARANA LEONEL R.;SANKMAN ROBERT L.;FENG WEN JANET;NICKERSON ROBERT M. |
分类号 |
H01L23/28;H01L21/50;H01L21/56 |
主分类号 |
H01L23/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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