发明名称 |
MANUFACTURING METHOD OF PCB |
摘要 |
PURPOSE: A method for manufacturing a printed circuit board is provided to accomplish process simplification, by eliminating a surface roughness formation process. CONSTITUTION: A circuit pattern(120) is formed on an insulation substrate(110). An ink mask layer(130) is formed on the circuit pattern. A metal pattern zone is formed by processing the ink mask layer. A metal pattern(140) is formed on the metal pattern zone. An electronic element chip(150) is mounted in the metal pattern. The ink mask layer includes acrylic resin and solvent. |
申请公布号 |
KR20110074174(A) |
申请公布日期 |
2011.06.30 |
申请号 |
KR20090131070 |
申请日期 |
2009.12.24 |
申请人 |
LG INNOTEK CO., LTD. |
发明人 |
PARK, JUN SOO;KIM, HYUNG JONG;CHUN, JIN GOO;LEE, KI YONG;YOO, JAE HYOUN |
分类号 |
H05K3/10;H05K3/18 |
主分类号 |
H05K3/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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