发明名称 MANUFACTURING METHOD OF PCB
摘要 PURPOSE: A method for manufacturing a printed circuit board is provided to accomplish process simplification, by eliminating a surface roughness formation process. CONSTITUTION: A circuit pattern(120) is formed on an insulation substrate(110). An ink mask layer(130) is formed on the circuit pattern. A metal pattern zone is formed by processing the ink mask layer. A metal pattern(140) is formed on the metal pattern zone. An electronic element chip(150) is mounted in the metal pattern. The ink mask layer includes acrylic resin and solvent.
申请公布号 KR20110074174(A) 申请公布日期 2011.06.30
申请号 KR20090131070 申请日期 2009.12.24
申请人 LG INNOTEK CO., LTD. 发明人 PARK, JUN SOO;KIM, HYUNG JONG;CHUN, JIN GOO;LEE, KI YONG;YOO, JAE HYOUN
分类号 H05K3/10;H05K3/18 主分类号 H05K3/10
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