发明名称 ANISOTROPIC CONDUCTIVE PASTE AND FILM, CIRCUIT CONNECTING STRUCTURE BODY COMPRISING THE SAME
摘要 PURPOSE: An anisotropic conductive paste and an anisotropic conductive film are provided to improve current resistance in connection. CONSTITUTION: An anisotropic conductive film(100) comprises an insulating binder(110), and conductive particles(120) which are dispersed in the insulating binder. The conductive particles contain copper core particles and a metal layer coated on the surface of the copper core particles. The anisotropic conductive film contains 99.9-80 weight parts of binder and 0.1-20 weight parts of organic resin and conductive particles. The coated metal layer contains silver-coated layer.
申请公布号 KR20110074321(A) 申请公布日期 2011.06.30
申请号 KR20090131246 申请日期 2009.12.24
申请人 CHEIL INDUSTRIES INC. 发明人 LEE, GYU HO;PARK, YOUNG WOO;CHO, IL RAE;PARK, KYOUNG SOO;KIM, YOUNG HUN;LEE, KYUNG JIN;JUNG, KWANG JIN;PARK, JIN SEONG;UH, DONG SEON
分类号 H01B1/22;H01B3/30;H01R11/01 主分类号 H01B1/22
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