| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a package that has increased capacity of heat dissipation, is compact and reliable, and is manufactured at low cost. <P>SOLUTION: A die package includes a substrate 20, a reflector plate 40, and a lens 50. The substrate 20 is made from thermally conductive but electrically insulating material. The substrate 20 has a plurality of traces for connecting an external electrical power supply to a light emitting diode (LED) at a mounting pad. The reflector plate 40 is coupled with the substrate 20 and substantially surrounds the mounting pad. The lens 50 is free to move relative to the reflector plate 40 and is capable of being raised or lowered by the encapsulant which adheres to it and is placed at an optimal distance from the LED chips. Heat generated by the LED during operation is drawn away from the LED by both the substrate 20 (acting as a bottom heat sink) and the reflector plate 40 (acting as a top heat sink). The reflector plate 40 includes a reflective surface 42 for directing light from the LED in a desired direction. <P>COPYRIGHT: (C)2011,JPO&INPIT |
