发明名称 CVD FILM DEPOSITION APPARATUS
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a CVD film deposition apparatus capable of removing particles produced in the film deposition apparatus and preventing the removed particles from flowing into the film deposition apparatus while retaining a pressure in the film deposition apparatus suitably at all times. <P>SOLUTION: In the CVD film deposition apparatus 60 in which a film deposition chamber 2 is arranged between a conveyance chamber 3 with a feeding roller 8 disposed therein and a conveyance chamber 4 with a winding roller 9 disposed therein, and a thin film is deposited on the surface of flexible substrate 5 to be conveyed to the film deposition chamber 2, cleaning chambers 17a, 17b are disposed on at least one part between the film deposition chamber 2 and the conveyance chamber 4, a gas gate 19 is arranged between the film deposition chamber 2 and the cleaning chambers 17a, 17b and between the conveyance chamber 4 and the cleaning chambers 17a, 17b, and the cleaning chamber 17a, 17b is provided with a cleaning roller 20 for removing the particles attached to the flexible substrate 5, a mechanism for supplying the gas to the vicinity of a contact part between the cleaning roller 20 and the flexible substrate 5 and a mechanism for adjusting a gas feeding quantity and a gas discharging quantity in the cleaning chambers 17a, 17b. <P>COPYRIGHT: (C)2011,JPO&INPIT</p>
申请公布号 JP2011127188(A) 申请公布日期 2011.06.30
申请号 JP20090287636 申请日期 2009.12.18
申请人 FUJI ELECTRIC CO LTD 发明人 NAKAHARA HIROAKI
分类号 C23C16/44;H01L31/04 主分类号 C23C16/44
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