| 摘要 |
PROBLEM TO BE SOLVED: To perform polishing while monitoring the advancing state of the polishing by measuring the damage amount on a substrate surface simultaneously polishing the substrate surface even in the case of a bare substrate having no film on its surface and consisting of, for example, a reactive semi-conductor single body. SOLUTION: During the polishing, the damage amount on the substrate surface is measured by using at least one of damage amount measuring methods such as the photo-electric type damage amount measuring system, the photo-luminescence light type damage amount measuring system, and the Raman light type damage amount measuring system, and the progress state of the polishing is monitored from the damage reduction on the substrate surface. COPYRIGHT: (C)2011,JPO&INPIT |
