THERMOSETTING RESIN COMPOSITION, METHOD FOR PRODUCING RESIN COMPOSITION VARNISH, PREPREG AND LAMINATE

摘要

Disclosed is a thermosetting resin composition which contains: a maleimide compound that contains an unsaturated maleimide compound having a specific chemical structure; a thermosetting resin; an inorganic filler; and a molybdenum compound. Also disclosed are: a laminate for a wiring board, which is obtained by applying a thermosetting resin composition that contains a thermosetting resin, silica and a specific molybdenum compound to a base, then semi-curing the resin composition to form a prepreg and laminating thus-formed prepregs; and a method for producing a resin composition varnish, which comprises a specific process. The thermosetting resin composition is capable of providing an electronic component such as a prepreg, a laminate or an interposer, which has low thermal expansion, excellent drilling processability and excellent heat resistance.