| 摘要 |
<p>Disclosed is a substrate for evaporating a volatile component, which is (1) capable of evaporating a volatile component without using a mechanical means such as pressing force, and (2) free from deterioration in volatility even in cases where the substrate is not hermetically packaged when out of use. Specifically disclosed is a substrate (10) for evaporating a volatile component, which is characterized by comprising a sheet-like base (20A), heating elements (30, 32) for selectively heating a partial region (40A) of the sheet-like base (20A), and a microcapsule which is arranged at least within a heated region (40) and comprises a core material that contains the volatile component and an outer shell material that covers the core material and is destroyed by heat.</p> |
