| 摘要 |
PURPOSE: A wafer polishing apparatus is provided to improve the polishing speed of a wafer by maximizing the flow of slurry and increasing the amount of the slurry supplied to the wafer. CONSTITUTION: In a wafer polishing apparatus, a bottom plate(100) supports a carrier(300) and a central gear(400). The bottom plate includes a first body and a first polishing pad. A top plate is arranged on the bottom plate. A carrier temporarily stores slurry supplied from a second polishing pad. The carrier includes a wafer accommodating groove(310), a slurry accommodating groove(320), and a slurry flow groove(330).
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