发明名称 Lead plate and protection circuit module having the same
摘要 A lead plate (50) for connecting a printed circuit board (PCB) of a secondary battery to an bare cell includes a mounting portion (32) connected to the PCB, a joint portion (54) connected to the bare cell, the mounting portion being configured to be heavier than the joint position, and a step portion (56) connecting the mounting portion and the joint portion to each other.
申请公布号 EP2339903(A2) 申请公布日期 2011.06.29
申请号 EP20100195485 申请日期 2010.12.16
申请人 SAMSUNG SDI CO., LTD. 发明人 KIM, BONG-YOUNG;KIM, YOUNG-HO
分类号 H05K1/18;H01M2/04;H01M2/22;H05K3/34 主分类号 H05K1/18
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