发明名称 |
Lead plate and protection circuit module having the same |
摘要 |
A lead plate (50) for connecting a printed circuit board (PCB) of a secondary battery to an bare cell includes a mounting portion (32) connected to the PCB, a joint portion (54) connected to the bare cell, the mounting portion being configured to be heavier than the joint position, and a step portion (56) connecting the mounting portion and the joint portion to each other. |
申请公布号 |
EP2339903(A2) |
申请公布日期 |
2011.06.29 |
申请号 |
EP20100195485 |
申请日期 |
2010.12.16 |
申请人 |
SAMSUNG SDI CO., LTD. |
发明人 |
KIM, BONG-YOUNG;KIM, YOUNG-HO |
分类号 |
H05K1/18;H01M2/04;H01M2/22;H05K3/34 |
主分类号 |
H05K1/18 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|