发明名称 |
Multi-stack package led |
摘要 |
<p>A multi-stack package light emitting diode (LED) includes an LED chip, a first fluorescent powder layer, a first optical bandpass filter layer and a second fluorescent powder layer. The LED chip generates an LED light. The first fluorescent powder layer and the second fluorescent powder layer respectively have a first fluorescent powder and a second fluorescent powder. The first fluorescent powder and the second fluorescent powder are excited by the LED light to respectively generate a first excitation light and a second excitation light. The first optical bandpass filter layer allows the LED light and the first excitation light to pass and reflects the second excitation light. A wavelength of the LED light is shorter than a wavelength of the second excitation light. The wavelength of the second excitation light is shorter than a wavelength of the first excitation light. Therefore, the multi-stack package LED improves a light emission efficiency.</p> |
申请公布号 |
EP2339655(A2) |
申请公布日期 |
2011.06.29 |
申请号 |
EP20100196526 |
申请日期 |
2010.12.22 |
申请人 |
INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE |
发明人 |
CHENG, CHIA-SHEN;LIN, JIAN-SHIAN;CHEN, SHAU-YI;LIN, HSIU-JEN;PENG, YAO-CHI |
分类号 |
H01L33/44;H01L33/46;H01L33/50 |
主分类号 |
H01L33/44 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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