PRINTED CIRCUIT BOARD WITH SINGLE-LAYER USING BUMP STRUCTURE AND MANUFACTURING METHOD OF THE SAME

摘要

PURPOSE: A single layer printed circuit board and a manufacturing method thereof are provided to implement the thin flat structure of the printed circuit board, by implementing a structure of comprising an internal metal bump performing the role of a via and a solder ball junction. CONSTITUTION: An insulating layer(110) for insulating a printed circuit board is prepared. An adhesive layer(120) is formed on the top surface of the insulating layer. The adhesive layer is formed with an adhesive material. A pad hole(130) is formed. The pad hole penetrates through the insulating layer and the adhesive layer. A meal seed layer(140) is formed on the top surface of the adhesive layer and the insulating layer. A circuit pattern(160) is formed on the top of the metal seed layer.