发明名称 |
Interface connecting dies in an IC package |
摘要 |
A package comprises a first die and a second die. An interface connects said first die and said die. The package comprises interrupt means comprises means for detecting interrupt information, means for providing a packet in response to said detecting means detecting interrupt information, said packet comprising an address to which data in said packet is to be written, said interface being configured to transport said packet. The storage means is provided to which said data is writable, an interrupt event being determined from data received in a plurality of said packets. |
申请公布号 |
EP2339476(A1) |
申请公布日期 |
2011.06.29 |
申请号 |
EP20090178184 |
申请日期 |
2009.12.07 |
申请人 |
STMICROELECTRONICS (RESEARCH & DEVELOPMENT) LIMITED |
发明人 |
JONES, ANDREW MICHAEL;RYAN, STUART |
分类号 |
G06F13/24;H01L25/065 |
主分类号 |
G06F13/24 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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