COATING FOR A MICROELECTRONIC DEVICE, TREATMENT COMPRISING SAME, AND METHOD OF MANAGING A THERMAL PROFILE OF A MICROELECTRONIC DIE

摘要

PURPOSE: A coating for a microelectronic device is provided to enable reliable coating to a die in a suitable fabrication condition. CONSTITUTION: A coating for a microelectronic device comprises a polymer film(131) including a filler. In the polymer film, thermal conductivity is 3 W/m·K and thickness(133) does not exceed 10 micron. The polymer film has a post-cure Young's modulus bigger than 3 GPa. The polymer film includes a first layer of a first thickness having a first filler and a second layer of a second thickness having second filler.