发明名称 |
CU-MG-P BASED COPPER ALLOY MATERIAL AND METHOD OF PRODUCING THE SAME |
摘要 |
<p>PURPOSE: A Cu-Mg-P based copper alloy material and a producing method thereof are provided to balance the tensile strength and elstic limit of the Cu-Mg-P based copper alloy material with a high level. CONSTITUTION: A Cu-Mg-P based copper alloy material comprises Mg 0.3~2 weight%, P 0.001~0.1 weight%, Cu, and inevitable impurities. The area rate of crystal grains is 45~55% of the measured area of the Cu-Mg-P based copper alloy material. The tensile strength of the copper alloy material is 641~70 N/mm2. The elastic limit is 472~503 N/mm2.</p> |
申请公布号 |
KR20110073209(A) |
申请公布日期 |
2011.06.29 |
申请号 |
KR20100062716 |
申请日期 |
2010.06.30 |
申请人 |
MITSUBISHI SHINDOH CO., LTD. |
发明人 |
SAKURAI TAKESHI;KAMEYAMA YOSHIHIRO;ABE YOSHIO |
分类号 |
C22C9/00;B21B3/00;C22F1/08 |
主分类号 |
C22C9/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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