发明名称 CU-MG-P BASED COPPER ALLOY MATERIAL AND METHOD OF PRODUCING THE SAME
摘要 <p>PURPOSE: A Cu-Mg-P based copper alloy material and a producing method thereof are provided to balance the tensile strength and elstic limit of the Cu-Mg-P based copper alloy material with a high level. CONSTITUTION: A Cu-Mg-P based copper alloy material comprises Mg 0.3~2 weight%, P 0.001~0.1 weight%, Cu, and inevitable impurities. The area rate of crystal grains is 45~55% of the measured area of the Cu-Mg-P based copper alloy material. The tensile strength of the copper alloy material is 641~70 N/mm2. The elastic limit is 472~503 N/mm2.</p>
申请公布号 KR20110073209(A) 申请公布日期 2011.06.29
申请号 KR20100062716 申请日期 2010.06.30
申请人 MITSUBISHI SHINDOH CO., LTD. 发明人 SAKURAI TAKESHI;KAMEYAMA YOSHIHIRO;ABE YOSHIO
分类号 C22C9/00;B21B3/00;C22F1/08 主分类号 C22C9/00
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