发明名称 LED PACKAGE AND RFID SYSTEM INCLUDING THE SAME
摘要 PURPOSE: A light emitting diode(LED) package and a radio frequency identification(RFID) including the same are provided to improve the emitting efficiency of a displaying device by connecting the displaying device and a substrate using a through-silicon-via. CONSTITUTION: An LED element(340) emits light. An electrostatic discharging element(330) includes an electrostatic discharging circuit by being formed at the lower side of the LED element. A printed circuit board includes a power supplying line by being formed at the lower side of the electrostatic discharging element. A heat sink board(310) is formed at the lower side of the printed circuit board. The heat sink board emits heat applied from the LED element through the electrostatic discharging element and the printed circuit board. A temperature sensor detects the temperature around the LED element.
申请公布号 KR20110072458(A) 申请公布日期 2011.06.29
申请号 KR20090129399 申请日期 2009.12.23
申请人 HYNIX SEMICONDUCTOR INC. 发明人 KANG, HEE BOK
分类号 H01L33/48;G06K19/07 主分类号 H01L33/48
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