| 摘要 |
<p>A technique of manufacturing a semiconductor device capable of performing a probe test by a common test apparatus as normal LSI chips even for large-area chips is provided. A chip comprising a device formed on a device area by a semiconductor process and including a plurality of test areas (301) sectioned by chip areas is prepared. Next, pads (101, 102, 103, 104) to be electrically connected to the device are formed at corresponding positions on the respective plurality of test areas (301). Subsequently, the respective test areas are tested by a same probe card via the plurality of pads.</p> |
