| 摘要 |
PURPOSE: A mobile terminal is provided to reduce the failure rate in mounting a camera module having an image sensor semiconductor in a substrate. CONSTITUTION: A semiconductor chip for the image sensing is installed on an upper side of a sensor substrate(231). It is included a plurality of leads for interlinking the semiconductor chip on the lower-part of the sensor substrate. A holder(235) is attached to be shut tightly on the top of the sensor substrate. A lens is included on the top of the holder. A circuit board(234) is included in the lower part of the sensor substrate. The circuit board supports the sensor substrate.
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