| 摘要 |
PURPOSE: A semiconductor chip bonding apparatus is provided to reduce required for a substrate driving unit by separating the substrate driving unit into two driving parts based on the stroke and the position precision. CONSTITUTION: A chip absorbing unit(100) absorbs a semiconductor chip(10) at an initial position. The chip absorbing unit includes an absorbing part(110), an elevation driving part, and a mode converting part(130). A substrate supporting plate supports a printed circuit board(20). A chip transporting unit transports the chip absorbing unit. A substrate driving unit transfers or rotates the substrate supporting plate. |
