PRINTED CIRCUIT BOARD WITH SINGLE-LAYER USING BUMP STRUCTURE AND MANUFACTURING METHOD OF THE SAME

摘要

PURPOSE: A single layer printed circuit board and a manufacturing method thereof are provided to form a reliable circuit pattern, by forming a carrier metal layer with the circuit pattern by adhering and pressing an adhesive material layer. CONSTITUTION: An adhesive layer(120) is formed on an insulating layer(110). The adhesive layer is formed with an adhesive material. A pad hole(130) is processed. The pad hole penetrates through the insulating layer and the adhesive layer. A carrier metal layer is formed on the top of the adhesive layer. The carrier metal layer includes a circuit pattern part(211) and a carrier part(210). A metal material is filled in the pad hole. A solder resist layer(150) is formed on an opposite side of a substrate where the circuit pattern is implemented.