| 摘要 |
<p>PURPOSE: A light emitting diode package and manufacturing method thereof are provided to make a transparent wall by the same materials as a sealing member, thereby completing an LED package without eliminating the transparent wall which is formed on a base. CONSTITUTION: At least one LED chip(34) is mounted on a base(31). A first electrode(32) and a second electrode(33) are placed on the base. A transparent wall(35) includes a filling space in the base. The filling space is filled with a fluorescent material(36) so that the fluorescent material covers the LED chip. A sealing member covers the entire transparent wall.</p> |
