| 摘要 |
PURPOSE: A package using surface mount technology is provided to prevent a foreign material on a pad formed on a module by separating the pad of a module from the end of a certain module. CONSTITUTION: In a package using surface mount technology, a module(20) includes a plurality of wires and circuit requesting a predetermined operation. A pad(21) is separated from the edge of the module by a certain interval. A solder resist(23) is attached to the module excluding an area in which a pad is attached. A PCB is electrically connected to the module through the pad. The solder resist is removed from a predetermined area between the pad and the edge of the module. |
