发明名称 IMAGE SENSOR AND FORMING METHOD THE SAME
摘要 PURPOSE: An image sensor and a manufacturing method thereof are provided to maximally suppress a noise and a dark current by applying a porous insulation layer to an interlayer insulation layer. CONSTITUTION: A first interlayer insulating layer(209) is formed on the upper side of a semiconductor substrate. A porous insulation layer(210) is formed on the upper side of the first interlayer insulation layer. A first contact plug is formed on the first interlayer insulation layer and the porous insulation layer. A metal wiring is formed on the semiconductor substrate with a first contact plug. A second interlayer insulation layer(214) is formed on the upper side of the semiconductor substrate with the metal wiring. A second contact plug is formed on the second interlayer insulation layer. A color filter layer and a micro lens are successively formed on the upper side of the semiconductor substrate with the second contact plug.
申请公布号 KR20110072308(A) 申请公布日期 2011.06.29
申请号 KR20090129183 申请日期 2009.12.22
申请人 DONGBU HITEK CO., LTD. 发明人 JEONG, SEONG HUN
分类号 H01L27/146 主分类号 H01L27/146
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