发明名称 |
Multilayer sheet, production method thereof and pressure-sensitive adhesive sheet using the multilayer sheet |
摘要 |
<p>To provide a pressure-sensitive adhesive sheet used during processing articles such as semiconductor wafers and laminate sheet used for such a pressure-sensitive adhesive sheet, which does not contaminate or break the semiconductor wafers during the processing and can minimize the curl of the articles due to residual stress of the pressure-sensitive adhesive sheet, a multi-layer sheet includes a composite film (2) containing a urethane polymer and a vinyl-based polymer as effective components and a first film (1) made of a material different from that of the composite film (2), wherein the urethane polymer is formed from a polyolefin diol and a polyisocyanate. A pressure-sensitive adhesive sheet is obtained by providing a pressure-sensitive adhesive layer (4) on at least one side of the multi-layer sheet.</p> |
申请公布号 |
EP1695820(B1) |
申请公布日期 |
2011.06.29 |
申请号 |
EP20060003489 |
申请日期 |
2006.02.21 |
申请人 |
NITTO DENKO CORPORATION |
发明人 |
YOSHIDA, YOSHINORI;AKAZAWA, KOUJI;KONTANI, TOMOHIRO;YANO, KOHEI |
分类号 |
B32B27/40;C08G18/62;C09J7/02 |
主分类号 |
B32B27/40 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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