Semiconductor device and production method thereof

摘要

A semiconductor device (101) comprises a support plate (30), a semiconductor element (10), and conductor posts (40) having a first end (41a) at one end and a second end (42a) at the other end. The second ends (42a) of the conductor posts (40) are connected to the semiconductor element (10). Furthermore, the conductor posts (40) are connected to the support plate (30) at a position on the side of the second end (42a) that is closer to the first end (41a). Here, the conductor posts (40) have a heat conductivity of 200 W/mK or higher and a Vickers hardness of 70 or lower.