| 摘要 |
PURPOSE: A method for fixing an interposer PCB for a BGA package test is provided to perform certification of characteristics of the BGA package by minimizing a height of the PCB. CONSTITUTION: A BGA package is removed from a mount board(10). A pad of the mount board is cleaned. A solder ball is attached to a lower contact pad of the interposer PCB(100). An interposer PCB is fused with the mount board. A solder layer(150) is smoothed on an upper contact pad of the interposer PCB. A gold plated layer is formed on the smoothed solder layer. |
