发明名称 Thermally conductive wall structure
摘要 There is described a wall structure for absorbing or transferring heat from or to the ground, the wall structure comprising a footing for the wall structure disposed in the ground below grade extending in the longitudinal direction of the wall structure, a vertical wall supported on and extending longitudinally in the direction of the footing, the vertical wall extending upwardly from the footing above grade to a predetermined height, and having upper, lower, interior, exterior and end surfaces, a sheath of insulation for enveloping the vertical wall's upper, end, interior and exterior surfaces and thermal conductors disposed in the wall structure to be in thermal communication with one another, at least some of the conductors extending outwardly from the footing into the ground, the thermal conductors facilitating heat transfer between the ground and the vertical wall.
申请公布号 US7966780(B2) 申请公布日期 2011.06.28
申请号 US20090474871 申请日期 2009.05.29
申请人 ENCON ENVIRONMENTAL CONSTRUCTION SOLUTIONS INC. 发明人 MARSHALL DALE;GALASSO CARLO
分类号 E04B2/00;E04B1/62;F24J3/08 主分类号 E04B2/00
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