发明名称 |
Luminous devices, packages and systems containing the same, and fabricating methods thereof |
摘要 |
The present invention is directed to a vertical-type luminous device and high through-put methods of manufacturing the luminous device. These luminous devices can be utilized in a variety of luminous packages, which can be placed in luminous systems. The luminous devices are designed to maximize light emitting efficiency and/or thermal dissipation. Other improvements include an embedded zener diode to protect against harmful reverse bias voltages.
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申请公布号 |
US7968355(B2) |
申请公布日期 |
2011.06.28 |
申请号 |
US20090386882 |
申请日期 |
2009.04.24 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
KIM YUSIK |
分类号 |
H01L29/06;H01L31/0328;H01L31/0336;H01L31/072;H01L31/109;H01L33/06;H01L33/10;H01L33/32;H01L33/38;H01L33/56;H01L33/62 |
主分类号 |
H01L29/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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