| 摘要 |
Embodiments of the invention provide a method of manufacturing a printed circuit board. The method includes the steps of mounting a strip substrate on a fixing member, and separating the strip substrate into unit substrates by performing a singulation process. The method further includes the steps of attaching solder balls onto the unit substrates using a mask disposed on the unit substrates, and fixing the solder balls on the unit substrates by performing a reflow process. |
