发明名称 Semiconductor device and manufacturing method thereof
摘要 A semiconductor device manufactured utilizing an SOI substrate, in which defects due to an end portion of an island-shaped silicon layer are prevented and the reliability is improved, and a manufacturing method thereof. The following are included: an SOI substrate in which an insulating layer and an island-shaped silicon layer are stacked in order over a support substrate; a gate insulating layer provided over one surface and a side surface of the island-shaped silicon layer; and a gate electrode which is provided over the island-shaped silicon layer with the gate insulating layer interposed therebetween. The gate insulating layer is formed such that the dielectric constant in the region which is in contact with the side surface of the island-shaped silicon layer is lower than that over the one surface of the island-shaped silicon layer.
申请公布号 US7968884(B2) 申请公布日期 2011.06.28
申请号 US20070945739 申请日期 2007.11.27
申请人 SEMICONDUCTOR ENERGY LABORATORY CO., LTD. 发明人 YAMAZAKI SHUNPEI;IKEDA KAZUKO;SASAGAWA SHINYA;SUZAWA HIDEOMI
分类号 H01L29/10;H01L29/76;H01L31/036;H01L31/112 主分类号 H01L29/10
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