发明名称 Semiconductor device and manufacturing method of the semiconductor device
摘要 A semiconductor device includes a semiconductor layer formed on an insulating layer; a gate electrode disposed on said semiconductor layer via a gate insulating film; a source/drain layer composed by including an alloy layer or a metal layer with a bottom surface in contact with the insulating layer, with joint surfaces to a channel region disposed along crystal orientation faces of said semiconductor layer; and impurity-doped layers formed in a self-aligned manner along interfaces of the alloy layer or the metal layer, and said semiconductor layer.
申请公布号 US7968396(B2) 申请公布日期 2011.06.28
申请号 US20090591648 申请日期 2009.11.25
申请人 SEIKO EPSON CORPORATION;RENESAS TECHNOLOGY CORPORATION 发明人 WATANABE YUKIMUNE;MIGITA SHINJI;MISE NOBUYUKI
分类号 H01L21/336 主分类号 H01L21/336
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