发明名称 Regeneration apparatus and regeneration method for electroless plating
摘要 A regeneration apparatus for an electroless plating solution, which includes a sensor for measuring the formation rate of phosphorous acid formed in a plating tank in response to a plating treatment, a split device for taking out a plating solution in the plating tank to transfer the plating solution to a first processing tank, a sensor for measuring the concentration of the phosphorous acid contained in the plating solution taken out, an addition device for supplying calcium carbonate or calcium hydroxide, an amount of which is required for producing a calcium phosphite from the phosphorous acid contained in the plating solution, to the first processing tank, a separation device for separating and removing the calcium phosphite produced in the first processing tank from the plating solution, and a return pump for transferring the plating solution from which the calcium phosphite has been separated and removed to the plating tank.
申请公布号 US7968149(B2) 申请公布日期 2011.06.28
申请号 US20100981943 申请日期 2010.12.30
申请人 MURATA CO., LTD. 发明人 TAKAGAMI HIDENORI;KAWAKAMI HIROSHI;KATO KAZUHIKO
分类号 B01J49/00 主分类号 B01J49/00
代理机构 代理人
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