发明名称 |
Semiconductor device and method of fabricating the same |
摘要 |
A method of fabricating a semiconductor device includes: mounting a semiconductor chip on a substrate; forming an upper connection terminal on a side of the substrate on which the semiconductor chip is mounted; forming a resin seal portion that seals the semiconductor chip and the upper connection terminal so that an upper surface of the upper connection terminal is exposed; and shaping the upper connection terminal so that the upper surface of the upper connection terminal becomes lower than an upper surface of the resin seal portion.
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申请公布号 |
US7968990(B2) |
申请公布日期 |
2011.06.28 |
申请号 |
US20070654704 |
申请日期 |
2007.01.17 |
申请人 |
SPANSION LLC |
发明人 |
TANAKA JUNJI;KASAI JUNICHI;MEGURO KOUICHI;ONODERA MASANORI;TAYA KOJI |
分类号 |
H01L23/02 |
主分类号 |
H01L23/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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