| 摘要 |
Methods for die-to-die wire-bonding, and devices and systems formed thereby, are described herein. A die to die wire-bonding method may comprise bonding a first conductive bump having a first bump size to a first die pad; bonding a first wire to a second die pad, the first wire bonded to the second die pad by a second conductive bump having a second bump size, the second bump size being smaller than the first bump size; and bonding the first wire to the first conductive bump.
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