发明名称 |
METHOD AND APPARATUS FOR APPLYING A PERFORATION IN AN INITIALLY FLAT LAMINATED SUBSTRATE WHEREIN THE SUBSTRATE IS FLAT AFTER IRRADIATION AND A POSSIBLE POSTTREATMENT. |
摘要 |
<p>The invention relates to a method and an apparatus for applying a perforation in a flat laminated substrate, such as a card having a thickness of at least 0.2 mm by irradiating the substrate by laser. When a perforation is applied by laser to such a card, it is often warped, leading to handling problems in the next processing steps. The invention may relate to a substrate which forms part of the booklet such as a passport. According to the invention the substrate is flat after the irradiation and a possible post treatment. According to a first embodiment the properties of the laser irradiation process are chosen such that the substrate is flat after the irradiation. According to a second embodiment the substrate is flattened after the irradiating by laser, for instance by heating the substrate.</p> |
申请公布号 |
NL2004015(C) |
申请公布日期 |
2011.06.27 |
申请号 |
NL20092004015 |
申请日期 |
2009.12.24 |
申请人 |
INDUSTRIAL AUTOMATION INTEGRATORS (IAI) B.V., |
发明人 |
COBBEN, JOHANNES IGNATIUS MARIE |
分类号 |
B26F1/31;B42D15/00;B42D15/10 |
主分类号 |
B26F1/31 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|