LED LIGHTING APPARATUS HAVING LED PACKAGE INTERGRATED ON CIRCUIT BOARD AND FABRICATING METHOD THEREOF

摘要

PURPOSE: An LED lighting apparatus with an LED package integrated with a circuit board and manufacturing method thereof are provided to directly mount a plurality of LED elements on a circuit board, thereby efficiently emitting heat generated from the LED elements. CONSTITUTION: A plurality of LED elements(120) is mounted on a circuit board(110). A support protrusion(112) is formed in the location which is adjacent to the side end of the circuit board. An optical permeability resin layer(130) covers the LED elements. An optical pattern is formed on the surface of the optical permeability resin layer. An LED package(100) is embedded in a housing(210).