发明名称 LAMINATE, CIRCUIT BOARD AND SEMICONDUCTOR DEVICE
摘要 Disclosed is a laminate including an insulating resin layer and a metallic foil formed in contact with the insulating resin layer. The laminate is characterized in that the interface stress between the insulating resin layer and the metallic foil represented by the following formula (1) is not more than 7×104, when the tensile modulus of elasticity (A) of the metallic foil at 25° C. is not less than 30 GPa and not more than 60 GPa, the thermal expansion coefficient (B) of the metallic foil is not less than 10 ppm and not more than 30 ppm, the bending modulus of elasticity (C) of the insulating resin layer at 25° C. is not less than 20 GPa and not more than 35 GPa, and the thermal expansion coefficient (D) of the insulating resin layer in the XY direction from 25° C. to Tg is not less than 5 ppm and not more than 15 ppm, Interface stress={(B)−(D)}×{(A)−(C)}×{Tg−25 [° C.]}  Formula (1) wherein, Tg represents the glass transition temperature of the insulating resin layer.
申请公布号 US2011149532(A1) 申请公布日期 2011.06.23
申请号 US200913061153 申请日期 2009.09.18
申请人 SUMITOMO BAKELITE CO, LTD. 发明人 TAKAHASHI AKIHITO
分类号 H05K1/18;B32B5/00;B32B15/08;B32B17/04;H05K1/00 主分类号 H05K1/18
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