Improved resistance to temperature-related degradation or deformation in a wafer-supporting chuck is provided by at least one shielding member that physically and/or thermally shields chuck components from effects of elevated temperature processing fluids.
申请公布号
WO2011073842(A2)
申请公布日期
2011.06.23
申请号
WO2010IB55552
申请日期
2010.12.02
申请人
LAM RESEARCH AG;LAM RESEARCH CORPORATION;BRUGGER, MICHAEL;LACH, OTTO