| 摘要 |
PROBLEM TO BE SOLVED: To attain a structure excellent in heat dissipation while reducing cost, in an electronic circuit device. SOLUTION: An electronic component 30 is arranged between a bus bar 10 and a base component 20, and a fixed terminal 12 which is formed in a part of the bus bar 10, and fixed to the base component 20. Thereby, a fixed part 70 is formed, and the fixed part 70 has a spring property. Then, the stability of the fixed part 70 acts so that a distance between the base component 20 and the bus bar 10 is narrowed by the spring property of the fixed part 70, and thus, the electronic component 30 is sandwiched between the bus bar 10 and the base component 20. Thereby, the electronic component 30 can be fixed without using a thermally conductive adhesive. Furthermore, heat in the bus bar 10 and the base component 20 can be dissipated. COPYRIGHT: (C)2011,JPO&INPIT |
